| Rigid-Flex PCB Demand on the Rise |
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| Tuesday, 04 November 2008 11:12 | |||
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TAIPEI, TAIWAN– Although third-quarter sales of high-density interconnect (HDI) boards did not meet expectations, rigid-flex PCBs performed much better. Demand for high-end handsets and consumer electronics spurred sales. Market experts are predicting further increases for 2009. In September, Compeq Manufacturing reported sales of rigid-flex PCBs at NT$300 to $400 million (US$9.13 million to $12.17 million). This is an increase over July and August figures of NT$100 to $200 million (US$3.04 to $6.08 million).Rigid-flex PCB sales account for 12% to 15% of total sales for Unitech Printed Circuit Board. Although the company is still in the trial period for its design, it expects to increase its workforce and equipment during the fourth quarter. Unimicron Technology turned a third-quarter profit of NT$200 million (US$6.08 million), an increase over second-quarter results of NT$50 million (US$1.5 million). The company predicts even better results in 2009 and plans to expand its capacity.
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| Last Updated on Tuesday, 04 November 2008 11:43 |
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Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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