| Report: Flip Chip and WLP Use Growing |
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| Written by Administrator | |||
| Monday, 06 October 2008 08:59 | |||
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AUSTIN, TX – The growth of flip chip and wafer level packaging is a bright spot in the industry, says researcher TechSearch International. The firm projects a compound growth rate of more than 14% for flip chip units and 14% for WLPs between 2007 and 2012. The drivers for flip chip continue to be performance and form factor. The use of flip chip for a variety of wireless products will contribute to the growth in 2009. An increasing number of suppliers of ASICs, field programmable gate arrays, DSPs, chipsets, graphics and microprocessors are expanding use of flip chip with solder bumps and copper pillars in package. Flip-chip-on-board continues to be found in automotive electronics, hard disk drives and watch modules. Many companies are planning to use micro bumps through silicon via products, according to TechSearch. The growth in WLPs is driven by increased demand for thinner, lighter-weight portable products, but WLPs are adopted for both form factor and performance reasons. WLPs have typically been used for low pin count (≤50 I/O) small die size applications, including analog devices such as power amplifiers and battery management devices, MOSFETs, image sensors, controllers and integrated passives. However, WLPs are now an option for larger die sizes with higher pin counts (≥100 I/O), says the firm. Gold bump demand continues to be dominated by LCD driver ICs, but die shrink has limited the growth in number of wafers. An increasing number of gold stud bumped devices are also shipping.
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Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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