| Free ECAD-MCAD Webinar Sept. 23 |
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| Written by Administrator | |||
| Thursday, 04 September 2008 17:08 | |||
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SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, announced The Future of ECAD-MCAD Collaboration Webinar would be broadcast Sept. 23 at 2 p.m. EDT. Presented by Mentor Graphics, the free event will explore business drivers and their impact on electro-mechanical design, as seen by the product lifecycle development experts at CIMdata. It also will introduce the industry’s most advanced solution for ECAD/MCAD collaboration, jointly developed by PTC and Mentor Graphics. Attendees will learn how to link disconnected ECAD-MCAD domains, track incremental updates instead of reviewing large databases with unknown changes, eliminate design re-spins and missed schedules, and how to reduce product development costs while optimizing performance. The Webinar will be presented by Larry Kenyon, product marketing manager for Mentor Graphics; Pawel Chadzynski, vice president of product management for PTC; and Ken Amann, director of research for CIMdata. To register, visit www.pcbshows.com/webinars.
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| Last Updated on Thursday, 04 September 2008 17:08 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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