| A Solution to PWB Pollution? |
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| Friday, 22 August 2008 13:50 | |||
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SHANGHAI–While consumers are becoming aware of the growing problems from electronic waste accumulating in landfills, chemists at Jiao Tong University may have developed a method that converts printed circuit board refuse into viable building material. After valuable metals are recycled from PCBs, the debris, typically comprised of epoxy resin, glass fibers and metallic residue from laminate and plating, ends up in landfills. With the new process, chemists can turn the debris, or pulp, into a material suitable for a number of applications. First, the pulp is crushed and any residual metallic components are removed using an electrostatic separator. The fine powder is then mixed and kneaded with unsaturated polyester to form a dough-like substance that can be heated and pressed into shapes such as planks. The recycled material has the properties consistent with construction materials, the scientists claim. “We tested the strength and hardness of our planks and showed that they have properties that are comparable with other building materials,” explains Zhenming Xu, leader of the research team. “We are confident that this material can be used for making products such as fences, sewer grates and park benches.”
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| Last Updated on Monday, 25 August 2008 10:57 |
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Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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