| IPC Concerned with Öko-Institut Proposed Chemical Bans |
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| Written by Administrator | |||
| Friday, 27 June 2008 07:47 | |||
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BRUSSELS – Industry leaders addressed concerns with the Öko-Institut report on the proposed expansion of RoHS substance restrictions at an IPC workshop on June 18.
Öko-Institut was contracted by the European Union to study the inclusion of additional hazardous substances in electrical and electronic equipment under the RoHS Directive. In its draft report, the Öko-Institut recommended the restriction of TBBPA, the flame retardant used to protect more than 80% of PCBs and found to be safe by a comprehensive EU risk assessment. In addition to TBBPA, HBCDDs, several phthalate plasticizers and all organic compounds containing chlorine and bromine are included in the report as suggested bans. “IPC is concerned that Öko-Institut’s recommendations are arbitrary and lack a sound scientific basis. Implemented, these recommendations will have a significant negative impact on our members,” explained Fern Abrams, IPC’s director of government relations and environmental policy. IPC is developing a supply chain white paper in response to the proposed restrictions.
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| Last Updated on Tuesday, 01 July 2008 11:24 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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