| Silicon Circuit Boards Improve Computing Performance |
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| Written by Kathy Nargi-Toth | |||
| Tuesday, 10 June 2008 08:04 | |||
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RESEARCH TRIANGLE PARK, N.C. -- RTI International has developed in new technique that may improve computer performance and significantly change the manufacturing process for electronics by eliminating the need for organic substrates. The technology places an unpackaged bare die directly onto a large area silicon substrate, bypassing traditional die packaging and subsequent package attachment to an organic based printed circuit board. According to the developers the technology will allow for a smaller overall system that will deliver higher performance and will have lower power requirements. The initial application for the technology is in the reconfigurable computing market where high performance, low power, and small size are critical. "We are pleased to see this innovative technology take the next step and enter the commercial marketplace where its potential can be applied in real world settings and products," said RTI International President and CEO Victoria Haynes. "We are optimistic that the work our scientists and engineers have invested in this technology will lead to significant advances in computing technology and innovative circuit board development." RTI International spun out a separate company to commercialize the technology, Beeco Inc. The spinout raised $5 million in venture capital. The money will be used to develop the company's first product and expand its management team, Beeco CEO John Goehrke said. Beeco has five employees and expects to expand to 11 by the end of the summer.
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| Last Updated on Tuesday, 10 June 2008 08:08 |
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Mentor Graphics Introduces FloTherm IC
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
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Printing Screens Revisited
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Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
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