| Silicon Circuit Boards Improve Computing Performance |
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| Written by Kathy Nargi-Toth | |||
| Tuesday, 10 June 2008 08:04 | |||
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RESEARCH TRIANGLE PARK, N.C. -- RTI International has developed in new technique that may improve computer performance and significantly change the manufacturing process for electronics by eliminating the need for organic substrates. The technology places an unpackaged bare die directly onto a large area silicon substrate, bypassing traditional die packaging and subsequent package attachment to an organic based printed circuit board. According to the developers the technology will allow for a smaller overall system that will deliver higher performance and will have lower power requirements. The initial application for the technology is in the reconfigurable computing market where high performance, low power, and small size are critical. "We are pleased to see this innovative technology take the next step and enter the commercial marketplace where its potential can be applied in real world settings and products," said RTI International President and CEO Victoria Haynes. "We are optimistic that the work our scientists and engineers have invested in this technology will lead to significant advances in computing technology and innovative circuit board development." RTI International spun out a separate company to commercialize the technology, Beeco Inc. The spinout raised $5 million in venture capital. The money will be used to develop the company's first product and expand its management team, Beeco CEO John Goehrke said. Beeco has five employees and expects to expand to 11 by the end of the summer.
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| Last Updated on Tuesday, 10 June 2008 08:08 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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