| PCB Makers Motivated by Market Margins |
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| Written by Philip Buonpastore | |||
| Wednesday, 21 May 2008 10:18 | |||
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TAIWAN ― Printed circuit board makers in the region are basing production on the profit margin of PCB products, according to reports.
Hannstar Board is the current leader in the low-cost notebook-use PCB market, while Gold Circuit Electronics (GCE) and Tripod Technology are apparently showing less interest, with GCE and Tripod focusing more on the high-end market, sources said.Industry reports claim that Hannstar Board currently holds 70% to 80% of the low-cost PCB market share, with shipments expected to rise in the second half of the year. The company’s shipment of low-cost notebook PCBs was 12.3 million units in the first quarter, and is expected to grow to near 13.5 million units in Q2, with its 2008 goal at 54 million units. GCE and Tripod are less interested in the low-cost notebook PCB segment, preferring instead to focus on higher profit applications. GCE is currently running at 80% of capacity, and with 100% utilization expected in the third quarter. The company reportedly will not increase its production into the low-cost segment because of current orders for high-end application PCBs, which have better profit margins. Tripod is also staying focused on high-end applications and reportedly has no plans to enter the low-cost notebook PCB segment, sources have stated. The company currently has a 15% margin, and moving into the low-cost segment would drive this figure down, according to reports.
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| Last Updated on Friday, 23 May 2008 11:31 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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