| Tessera Licenses Shellcase MVP to Nemotek |
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| Written by Philip Buonpastore | |||
| Wednesday, 30 April 2008 09:40 | |||
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SAN JOSE, CA and RABAT, MOROCCO – Tessera Technologies, Inc. and Nemotek S.A. have announced that Nemotek has licensed Tessera’s Shellcase MVP technology, which will reportedly allow OEMs and camera module manufacturers the ability to build smaller and thinner consumer devices, such as camera phones, digital cameras, PDAs and laptops. “We are making the transition from traditional packaging technology to... through-silicon via wafer-level packaging technology by offering [our] high-volume capabilities to image sensor makers around the world.” said Youssef Benmokhtar, Nemotek’s director of marketing. “Both Nemotek and their customers will reap the benefits of higher yield and lower production costs, which will be passed on in the form of cost savings throughout the manufacturing supply chain,” said Bents Kidron, Tessera marketing VP.
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| Last Updated on Wednesday, 30 April 2008 09:42 |
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Mentor Graphics Introduces FloTherm IC
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
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