| Tin Hits Record Prices |
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| Written by Philip Buonpastore | |||
| Tuesday, 29 April 2008 15:05 | |||
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LONDON – According to a Reuters report, tin prices at record highs are expected to curb demand by the packaging and electronic industries, and may discourage the use of the metal in emerging technology areas. Tin, widely used in solder for electronic products, hit $24,600 a metric ton last week, up 45% in 2008."Everyone is quite worried about what impact the higher price might have on demand," said Peter Kettle of tin consultant firm ITRI. Solders account for around 50% of global tin consumption, estimated at around 365,000 metric tons last year. High prices could curtail usage, as well as causing cause a slowdown in the transition to high tin content lead-free solders, creating problems in the electronics sector. "There isn't any risk of a major switch in the next few years… but [it will probably] slow the continuing transition from the conventional tin-lead solders to lead-free solders," Kettle said. The move to lead-free solders has been the strongest growing market for tin in recent years. Currently, lead free solder accounts for 60% of the market, and higher tin costs would make it difficult to increase market share, according to Kettle.
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| Last Updated on Wednesday, 30 April 2008 14:50 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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