iNEMI to Work on Early Failure Detection for Lead-Free Products Print E-mail
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Written by Kathy Nargi-Toth   
Wednesday, 02 April 2008 12:00

LAS VEGAS, NVThe International Electronics Manufacturing Initiative (iNEMI) has new projects scheduled for launch this spring.

These projects are designed to assist the industry address common challenges. The project identified include: Pb-Free Alloy Alternatives, Pb-Free Early Failure, Boundary Scan Adoption and Solder Paste Deposition.

“iNEMI’s roadmapping and gap analysis activities help us identify those technology and infrastructure gaps where it makes sense for industry to collaboratively develop common solutions,” said Jim McElroy, CEO of iNEMI.  “We focus our efforts on activities that will lead to accelerated deployment of new technologies, development of industry infrastructure, dissemination of efficient business practices and/or stimulation of standards.  The initiatives we are currently organizing address needs identified by iNEMI roadmaps and, in all cases, represent activities that would not have as much impact on the supply chain if undertaken by a single company.” 

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Last Updated on Monday, 07 April 2008 12:24
 

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