| “Flexible†Circuit Boards in Development |
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| Written by Philip Buonpastore | |||
| Tuesday, 01 April 2008 12:19 | |||
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URBANA - CHAMPAIGN, ILLINOIS - US Scientists report that they believe they are on the way to creating a truly flexible circuit board that could be used in applications previously unavailable in PCB technology Professor John Rogers of the University of Illinois and colleagues have created flexible silicon and plastic circuits that are just 1.5 micrometres thick. Researchers have reported that the boards are made of silicon "nanoribbons" and can be flexed and folded, and that circuit boards with this type of flexibility could be used in biomedical applications. Professor Rogers said, "The notion that silicon cannot be used in such applications because it is intrinsically brittle and rigid has been tossed out the window. Through carefully optimized mechanical layouts and structural configurations, we can use silicon in integrated circuits that are fully foldable and stretchable."
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| Last Updated on Tuesday, 01 April 2008 12:25 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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