| Ormecon's Nanofinish Enters Production |
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| Written by Philip Buonpastore | |||
| Monday, 24 March 2008 10:58 | |||
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HAMBURG, GERMANY – Seven months after its introduction, Ormecon has announced the first mass production of PCBs using the company’s “Organic Metal Nanofinish." In an announcement made by company CEO Dr. Bernhard Wessling at the international Printed Circuit Board Technology Conference in Shanghai, the company will begin regular production schedule of a small amount of boards at a customer site on March 26. According to the announcement, April production will increase to 10,000 square feet per month, with production rising to approximately 100,000 square feet per month by mid-year. The company has over 55 evaluation projects currently in process, with over 35 of these in PCB manufacturing. Dr. Wessling expressed that the degree of response in the market is active and positive. According to the company, the product is provided as ready-to-use dispersions, lacquers, paints and blends for various applications in PCB manufacturing, corrosion protection, antistatic and conductive surface modification, organic and polymer light emitting diodes (OLEDs, PLEDs), "plastic electronics" and many other applications.
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| Last Updated on Tuesday, 25 March 2008 12:13 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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