| Engelmaier Releases White Paper on PCB Quality. |
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| Written by Philip Buonpastore | |||
| Friday, 21 March 2008 10:09 | |||
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ORMOND BEACH, FL - Engelmaier Associates
has announced the release of version v.08 of the White Paper titled:
"Recommendations for PCB FAB Notes and Specifications in Printed
Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the
Qualification of PCB Shops and Activities to Assure Continued Quality."
The report covers problems in electronic product reliability caused by the change to lead-free solders as it concerns PCB fabrication. As indicated by the title, recommendations are made regarding appropriate specifications and ‘FAB Notes’ on drawings for printed circuit boards (PCBs), general procedures to qualify PCB shops, and the assurance of producing good quality PCBs, with testing procedures to verify quality and reliability. Version v.08 includes 29 specific FAB Notes, many with sub-notes, for the specification of PCBs to be utilized in lead-free solder assemblies.
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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