| Taiwan IC Substrate Makers See Seasonal Decline |
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| Written by Philip Buonpastore | |||
| Wednesday, 13 February 2008 10:51 | |||
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TAIWAN - Major IC substrate suppliers all saw January sales decline seasonally, but report that they expect demand to increase in March. Nan Ya Printed Circuit Board (NPC) reported $116.34 million in sales for January, down 8.7% sequentially. Company sources said NPC expects its sales to drop 15-50% in the first quarter, attributing the decline to reduced orders from Apple for consumer electronics applications. Sources report that although Intel has announced lower sales expectations for the first quarter, NPC's flip-chip substrate capacity, which primarily supplies Intel demand, remains at high levels. Kinsus Interconnect's revenues for January fell 4% sequentially to $36.6 million on the seasonal downturn of the memory card segment, according to the company, and although demand is expected to grow in the coming months, Kinsus reported that first quarter sales are likely to be the lowest of the year. Phoenix Precision Technology (PPT) reported a 5.7% sequential decline in January sales to $32 million. Market sources estimate that PPT's first quarter sales may decline 19% compared to the fourth quarter's $118 million.
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| Last Updated on Wednesday, 13 February 2008 16:41 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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