| Verdant Adds New Occam Process Advisors |
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| Written by Philip Buonpastore | |||
| Tuesday, 15 January 2008 10:19 | |||
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Sunnyvale, CA - Verdant Electronics announced the addition of three process advisors, Michael Carano, Bernie Siegal and Henry Utsunomiya. “I am truly honored to have these three exceptional individuals join the Verdant Electronics Board of Advisors,” said Verdant President Joe Fjelstad. “The addition of these highly respected and talented individuals to the advisory board will help address technical needs, and drive Occam into a wider range of new and potential markets,” he added. The Occam process is a developing technology for both PCBs and PCBAs, intended to improve the way electronic products are made. The company claims that the method simplifies PCB fabrication and assembly, reducing cost and improving reliability, and that products made with the process will inherently comply with the EU’s RoHS legislation.
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Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Features
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....


