Verdant Adds New Occam Process Advisors Print E-mail
User Rating: / 0
PoorBest 
Written by Philip Buonpastore   
Tuesday, 15 January 2008 10:19

Sunnyvale, CA - Verdant Electronics announced the addition of three process advisors, Michael Carano, Bernie Siegal and Henry Utsunomiya.

“I am truly honored to have these three exceptional individuals join the Verdant Electronics Board of Advisors,” said Verdant President Joe Fjelstad. “The addition of these highly respected and talented individuals to the advisory board will help address technical needs, and drive Occam into a wider range of new and potential markets,” he added.

The Occam process is a developing technology for both PCBs and PCBAs, intended to improve the way electronic products are made. The company claims that the method simplifies PCB fabrication and assembly, reducing cost and improving reliability, and that products made with the process will inherently comply with the EU’s RoHS legislation.


blog comments powered by Disqus
 

Products

Grieve Introduces No. 952 Oven
No. 952 is a 550°F electrically-heated forced air convection bench oven, currently used for various programmed heat processings. Workspace dimensions measure 26" x 22" x 16". 3kW installed in Incoloy-sheathed tubular elements provide heat to the workload. A 1/80-HP recirculating blower creates a convection air movement in the chamber. Features 3" insulated walls, an aluminized steel exterior, Type 430 stainless steel interior and an integral oven stand. Has a programmable and recording temperature controller with 10" diameter circular chart, plus a manual reset excess temperature controller...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

Improving Fabrication Yields
How the CAM engineer can make the difference.  Embedded in fabrication planning is calculating panel size, checking layer stackup information, reviewing expected yields, reviewing board construction and verifying impedance control calculations. Typical panel sizes are 9 x 12˝, 12 x 18˝, 18 x 24˝, or 18 x 36˝. A number of factors need to be considered when calculating panel size. For instance, consider a small board of 25 sq. in. A relatively high number of this small board can be panelized...

Current Issue

January 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook