| Verdant Adds New Occam Process Advisors |
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| Written by Philip Buonpastore | |||
| Tuesday, 15 January 2008 10:19 | |||
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Sunnyvale, CA - Verdant Electronics announced the addition of three process advisors, Michael Carano, Bernie Siegal and Henry Utsunomiya. “I am truly honored to have these three exceptional individuals join the Verdant Electronics Board of Advisors,” said Verdant President Joe Fjelstad. “The addition of these highly respected and talented individuals to the advisory board will help address technical needs, and drive Occam into a wider range of new and potential markets,” he added. The Occam process is a developing technology for both PCBs and PCBAs, intended to improve the way electronic products are made. The company claims that the method simplifies PCB fabrication and assembly, reducing cost and improving reliability, and that products made with the process will inherently comply with the EU’s RoHS legislation.
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How the CAM engineer can make the difference. Embedded in fabrication planning is calculating panel size, checking layer stackup information, reviewing expected yields, reviewing board construction and verifying impedance control calculations. Typical panel sizes are 9 x 12˝, 12 x 18˝, 18 x 24˝, or 18 x 36˝. A number of factors need to be considered when calculating panel size. For instance, consider a small board of 25 sq. in. A relatively high number of this small board can be panelized...
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