Mentor Technology Leadership Awards Call for Entries Print E-mail
User Rating: / 0
PoorBest 
Written by Kathy Nargi-Toth   
Thursday, 10 January 2008 09:58
WILSONVILLE, OR - Mentor Graphics Corporation announced a call-for-entries for its 20th annual Technology Leadership Awards competition. The competition recognizes engineers and computer aided design (CAD) designers who use Mentor tools to address complex PCB systems design challenges and produce industry-leading products.

Entries can be submitted from January 10th through March 14, 2008. Entrants can apply online at www.mentor.com/go/tla. Judging will be based on overcoming complexity challenges, such as small form factor, high-speed content, design team collaboration, advanced PCB fabrication technologies and design-cycle time reduction. Judging will start in mid-March and winners will be announced at the PCB Design Conference East, Tinley Park, IL in May 11-16, 2008.

PCB industry experts will judge the contest. This year’s judges include Happy Holden, senior technology specialist of Mentor Graphics; Gary Ferrari, technical support director, FTG Circuits; Pete Waddell, vice president of UP Media, publisher of Printed Circuit Designs & Fab Magazine; and Rick Hartley, senior principal engineer, avionics division of  L-3 Communications.

Entrants can submit their design accomplishments in any of six categories representing a wide variety of industries:
·        PC computers and peripherals
·        Consumer electronics and handhelds
·        Industrial control, instrumentation, security and medical
·        Military and aerospace
·        Telecom switches, network servers, base stations and computer mainframes
·        Transportation and automotive

“Mentor Graphics is committed to the PCB systems design community, and our PCB Technology Leadership Awards contest provides the opportunity to showcase the most innovative and talented designers worldwide,” said Henry Potts, vice president and general manager, systems design division, Mentor Graphics. “The program continues to attract the most skilled users of our PCB systems design tools and Mentor expects this year’s competition to be bigger than ever with entries from virtually all the major electronics countries in the world.”

 

 

blog comments powered by Disqus
Last Updated on Monday, 14 January 2008 17:00
 

Products

Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....

Current Issue

June 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook