| Semiconductor Experts Cautious in 2008 |
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| Written by Philip Buonpastore | |||
| Monday, 07 January 2008 14:03 | |||
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OAK BROOK, IL - Semiconductor International hosted the 2008 Semiconductor Industry Forecast,
featuring a panel of industry leaders sharing predictions for the New
Year. The panel included Anne Craib of the SIA, Richard Gordon of
Gartner Dataquest Research, Gary Grandbois of iSuppli, Jim Feldhan of
Semico Research, Steve Szirom of InsideChips.com, Moshe Handelsman of
Advanced Forecasting, Gary Smith of Gary Smith EDA, independent analyst
Mike Cowan, and Carl Johnson of Infrastructure. As reported by PCB Cafe, the panel discussed the demand for traditional consumer devices (such as MP3 players, digital TVs and cell phones) accounting for over 50% of semiconductor production, as well as PC unit demand, now almost 40% consumer-driven. The majority of the panelists predicted that the worldwide semiconductor would see growth in the 6-11% range, while three others predicted a year of flat or even negative growth, siting concerns about a possible recession in the US due to the higher oil prices and current mortgage crisis. These concerns have made analysts cautious, but still optimistic, that semiconductor revenues will continue to grow in 2008.
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| Last Updated on Monday, 07 January 2008 14:07 |
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Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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