| Dimatix Launches Cartridge-Based Ink Jet Printer |
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| Written by Andy Shaughnessy | |||
| Thursday, 15 September 2005 19:26 | |||
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SANTA CLARA, CA – Inkjet product maker Dimatix has launched the Dimatix Materials Printer (DMP) system for the jetting of fluids, including nanoparticle-based metallic and organic materials, silver and nickel. The turnkey system reportedly allows quick development and testing of processes and prototypes, and the low-volume manufacturing of multilayer PCBs, flexible circuits, RFID tags and DNA arrays. “If you work in R&D, you now have a tool that prints faster than anything on the market,” said Martin Schoeppler, VP of corporate strategic business development for Dimatix. “If you’re in the business of making flex boards or you’re Samsung and you want to make large area displays, you can use this too.” Dimatix was founded in 1984 as Spectra, now the name of the company's printer division based in New Hampshire. The company’s piezoelectronic inkjet printers operate in the additive mode, creating traces on circuit boards without etching or masking. The DMP system can print almost any fluids onto plastic, metal, silicon and paper. Unlike typical consumer inkjet printers that use heat, the Dimatix piezoelectric inkjet pumps fluid through a nozzle with acoustic and mechanical energy – not heat. “It works with any fluids – nickel is in use, and these nanoparticle electronics materials,” Schoeppler said. “Our technology is very forgiving as far as what fluids you can use, because we’re not heating the fluid.” The technology is still evolving, and Schoeppler expects to be able to print lines and spaces below 10 microns in six months. Dimatix has 250 employees in Lebanon, NH, and 50 in Santa Clara.
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Automatic Lamination Techologies Debuts VA 7124 HP6 Vacuum Applicator
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
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