January 2008 Issue Print E-mail
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Tuesday, 01 January 2008 00:00
January 2008 cover

FEATURES

PTH Reliability
Designing to Improve PTH Reliability
Understanding the critical process steps in design, fabrication and assembly can increase the robustness of the PTH and improve reliability.
by Zulki Khan

PTH Reliability
The Survival and Long-Term Reliability of Lead-Free PCBs
A DfA program that designs and specifies PCBs compatible with lead-free soldering is often at odds with a cost driven manufacturing metric.
by Werner Engelmaier

iNEMI's Emerging Technologies
Research Priorities for the Electronics Industry
The merger of micro and nano, chemical, and other sensors with micro- and nano-electronics could mean disruption ahead.
by Alan Rae, Ph.D., Robert C. Pfahl, Ph.D., and Charles Richardson

From the Field
Designs That Exceed Expectations
An interview with Chantal Holloway and Guillaume Turgeon - two of the 2007 winners of the Mentor Graphics PCB Technology Leadership Awards.
by Kathy Nargi-Toth

Printed Circuit Design & Fab Annual Buyers Guide
Trying to locate suppliers for your design or fabrication project? Look no further.

 

POINT OF VIEW

Our Line
China's labor pains.
Kathy Nargi-Toth

ROI
The ability to identify and quickly implement technology change is often the difference between mediocrity and excellence.
Peter Bigelow

EMC for the Real World
To control emissions, high-speed signals should not be routed near the edge of the ground-reference plane.
Dr. Bruce Archambeault

BGA Bulletin
BGA miniaturization amplifies the design challenge of balancing high-performance signal integrity with fabrication cost reduction.
Charles Pfeil

 

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Last Updated on Wednesday, 06 February 2008 16:44
 

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ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...

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Features

In Case You Missed It
Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...

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