Remtec Releases AgENIG Ceramic Substrates Print E-mail
Written by Chelsey Drysdale   
Tuesday, 16 April 2013 22:04

AgENIG (electroless nickel and immersion gold plating over thick film silver) substrates reportedly offer performance advantages when using Pb-free, higher temperature solder required for RoHS compliance.  Are said to eliminate solder leaching; enable processing up to 260°C or higher; permit multiple SMT reflow solder cycles, touchup and repairs. Are suitable for assembly types including SMT soldering and die attach. Addition of a thin layer of palladium plating permits gold wire bonding and eutectic die attach. Products can be used up to 170°C continuous operating temperature. Pattern definition can be held to 0.006" line and spaces.

Remtec, www.remtec.com

 

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