Atotech Rolls Out BondFilm MS 500 Print E-mail
Written by Chelsey Drysdale   
Wednesday, 27 February 2013 17:47

BondFilm MS 500 is a super-concentrate that employs new additives. Has enhanced adhesion at standard etch depths; compatibility with a range of materials (high and low Tg, halogen-free). Offers good adhesion along copper loading curve in terms of initial peel strength. Great thermal reliability; acid resistance above five min.; copper loading window up to 28g/L.

Atotech, www.atotech.com

 

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