Lord Releases Thermoset UR-288 Encapsulant Print E-mail
Written by Mike Buetow   
Tuesday, 27 November 2012 14:19

Thermoset UR-288 urethane encapsulant cures at room temperature to produce a flame-retardant, semi-flexible material. Exhibits low shrinkage and stress on components as it cures, and maintains a low viscosity that reportedly achieves complete, void-free encapsulation. Suitable for curing at room temperature. Produces low exothermic heat rise during cure.

Lord Corp., lord.com/electronicmaterials

 

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