Atotech Rolls Out Uniplate Cu InPulse 2 Advanced PTH Fill System Print E-mail
Written by Chelsey Drysdale   
Thursday, 19 December 2013 17:46

Uniplate Cu InPulse 2 Advanced is for through-hole filling. Reportedly can completely fill through-holes, such as those laser-drilled in panels up to 200µm thick with a surface diameter of 100µm. Is suitable for all copper plating applications. Displays a high flexibility, such as with BMV filling or super filling. Combines bridge plating and super filling. Controls electrolyte flow by individual pressure measurements at each anode; provides filtration down to 4.5µm.

Atotech, www.atotech.com

Last Updated on Friday, 20 December 2013 16:55
 

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