| Rohm and Haas Releases VisionPad VP3100 CMP |
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| Written by Tracy Heffner | |||
| Monday, 19 September 2005 11:45 | |||
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PHOENIX, AZ – Rohm and Haas Electronic Materials has released its VisionPad VP3100 polishing pad that allegedly combines the benefits of hard and soft pads for advanced CMP applications. It is said to provide customers with excellent planarization capability and low defectivity during volume production of copper (Cu) wafers. The VisionPad VP3100 polishing pad is the first unveiling in the company's new VisionPad CMP polishing pad series. Its proprietary polyurethane formulation provides a softer surface than a traditional hard pad. By using a new group of polymer chemistries, the pad technology reportedly improves die yields through minimization of scratches and chatter marks across the wafer. "As customers move toward 65nm node device production, they're experiencing yield losses from defects that were once tolerable. The VisionPad VP3100 polishing pad responds to this challenge by offering a low defectivity pad with superb planarization characteristics in the copper barrier step," said Cathie Markham, vice president of technology, Rohm and Haas Electronic Materials. Although targeted for 65nm applications, the VP3100 CMP pad has the ability to backfill into current 130nm and 90nm processes. The VP3100 pad is currently in production at Asian foundries and a European device manufacturer, and will be available in January 2006.
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Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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