| FTG Q1 Sales Rose 8% |
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| Tuesday, 07 April 2009 13:07 | |||
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TORONTO – Firan Technology Group Corp. (FTG) reported first-quarter sales climbed 8% year-over-year to $14.7 million, on the strength of the US dollar. The gross margin, as a percentage of sales, rose 31%. The circuit segment saw sales increase 9% to $11.5 million, while sales for the aerospace segment grew 6% to $3.2 million. For the quarter, ended February 27, net loss was $67,000, compared to $1.04 million last year. Total bookings were $13.3 million, and the book-to-bill was 0.91:1 for the corporation and 0.97:1 for the circuits segment. During the quarter, FTG renewed multiyear contracts with Honeywell and Rockwell, renewed and expanded its credit facilities with Comerica bank and acquired Laser Direct Imaging Technology in Circuits-Toronto.
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Design News
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Fab News
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ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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