| Update: Isola and Iteq Settle Patent Dispute |
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| Thursday, 20 November 2008 09:51 | |||
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CHANDLER, AZ – Isola USA Corporation has settled its complaint against Iteq Corporation. In October, Isola had filed a complaint with the United States International Trade Commission regarding the unlawful importation of certain prepregs, laminates and printed circuit boards (PCBs) that infringed on the company’s patents. Iteq has agreed not to produce, use, sell or distribute its product 200DK, as well as any other products that infringe on Isola’s patents. Isola had raised issue with samplings and small-scale production, and Iteq suspended production and sampling after the complaint was made. The company has acknowledged the validity and enforceability of Isola's patents at issue. Financial details have not been disclosed. Since September, Isola has been in litigation with Taiwan Union Technology (TUC). An injunction was filed against TUC for its infringement on patent no.123529, “Fillers for Improved Epoxy Laminates." Isola has filed complaints against several additional companies, Ventec Electronics, Guangdong Shengyi Sci Tech, VGL USA LCC and Sanmina-SCI, regarding patents related to prepreg, laminate and PCB products.
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| Last Updated on Friday, 21 November 2008 10:12 |
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Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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