| PCB West 2008 Awards Top Gun |
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| Written by Kathy Nargi-Toth | |||
| Thursday, 18 September 2008 08:54 | |||
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SANTA CLARA, CA -- PCB West 2008 events included the presentation of the PCB Top Gun Hall of Fame Award. Each year, the PCB Top Gun Hall of Fame contest endeavors to find the top designers in the world. During two days of competition at PCB West, participants are put through a stringent battery of tests, including a written exam, personal interviews, and an actual design challenge. This year’s winner is Gary Kipp from Intel. He is the president of the Pacific Northwest IPC Designers Council. He has been designing boards for over 15 years. He’s worked on diverse projects including CPU adapter cards, RF designs, video test cards, power supplies, PCI plug cards, memory and motherboards. Prior to joining Intel he spent two years working at a service bureau. Jean Stout provided overview and coordination for the contest. Judges included last year’s winner Randy Holt from ODA, Tom Stout from ODA, the 1999 winner, Charlie Capers from Trilogy Circuits – Dallas, and Max Clark from Valor.
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Products
Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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