| Agilent and T-Tech Collaborate on RF PCB Design and Fab Solution |
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| Written by Kathy Nargi-Toth | |||
| Wednesday, 03 September 2008 11:54 | |||
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SANTA CLARA, CA and NORCROSS, GA -- Agilent Technologies Inc. and T-Tech Inc. will collaborate on a turnkey approach for fast RF printed circuit board (PCB) design, verification and fabrication. The collaboration combines Agilent's Genesys RF and microwave circuit design and verification software with T-Tech's Quick Circuit System for PCB prototyping. "Collaborating with T-Tech, Agilent can provide a complete turnkey design and fabrication flow for high-speed/high-frequency PCB designers," said Todd Cutler, marketing and services manager of Agilent's EEsof EDA division. "It will enable our customers to work from idea to physical prototype all within the Genesys software environment." "By partnering with Agilent to integrate its Genesys suite of EDA tools with our high-frequency, precision PCB fabrication machines, we will give our shared customers the ability to go from desktop design to physical prototype in hours instead of weeks or months," said John Taylor, president of T-Tech.
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| Last Updated on Wednesday, 03 September 2008 12:07 |
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Mentor Graphics Introduces FloTherm IC
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
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Printing Screens Revisited
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
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