| Report: Electronic Component Output Up in Q3 |
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| Friday, 21 August 2009 15:13 | |||
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TAIPEI, TAIWAN – Electronic component output should continue its sequential growth during the third quarter, according to the Industry and Technology Intelligence Services (ITIS). Second-quarter output climbed 30% quarter-on-quarter to NT$145.5 billion (US$4.4 billion) on a rise in customer demand from China. Third-quarter output is forecast to increase 20% sequentially to NT$174 billion (US$5.3 billion) the technology intelligence provider reports. Output for the year is expected to be NT$601.1 billion (US$18.3 billion), 16% less than 2008. Semiconductor output showed the strongest growth, up 43% from last quarter at NT$14 billion (US$426 million). The upward trend is attributed to demand for consumer ultra low voltage (CULV) notebooks and gray market handsets, or “bandit” mobile phones. The handsets, containing components made in Taiwan, resemble branded phones but are sold in China for much less. PCB output is forecast to climb 36% sequentially to NT$75.7 billion (US$2 billion), reports ITIS.
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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