| Semi Sales Continue Recovery |
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| Tuesday, 07 July 2009 09:55 | |||
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SAN JOSE – The 90-day moving average sales of semiconductors rose 5.4% sequentially to $16.5 billion worldwide in May, the Semiconductor Industry Association reported. May sales were down 23.2% year-over-year, but it's the third straight month of growth for the sector. “The May sales numbers reflect the third-consecutive month of sequential growth for the semiconductor industry,” said SIA president George Scalise in a statement. “The sequential monthly increases lead us to be cautiously optimistic about a return to normal seasonal patterns for the industry going forward.” Scalise noted that as semiconductors become ever-more pervasive in a growing array of products, the global microchip industry increasingly mirrors the performance of the overall economy. “As consumer confidence returns and the economy resumes growth, we expect the industry to reflect those patterns,” Scalise said.
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Design News
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- Mentor Announces PCB Technology Leadership Awards
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Market News
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Fab News
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Products
ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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