UP Media Group Announces PCB Atlanta Show Print E-mail
User Rating: / 0
PoorBest 
Written by Administrator   
Monday, 23 February 2009 15:17
SMYRNA, GA, -- PCB Atlanta is a one-day trade show and free technical program taking place October 22, in the north Atlanta suburb of Alpharetta, GA.

The event, one of a series sponsored by UP Media Group, is ideal for PCB designers, engineers, fabricators and purchasing managers. PCB Atlanta 2009 will be held at the Atlanta Marriott Alpharetta, just minutes north of the city.

The to-be-announced technical program will include talks on HDI, routing and placement, surface finishes, board fabrication and other related topics.

The accompanying tabletop exhibition is expected to draw more than 40 leading suppliers from the printed circuit design and fabrication industry.

For more information about PCB Atlanta 2009, visit www.pcbshows.com or contact Show Manager Alyson Skarbek at 678-589-8865 or This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
blog comments powered by Disqus
 

Products

ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

In Case You Missed It
Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...

Current Issue

June 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook