| PCB West Registration Open |
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| Tuesday, 16 June 2009 12:50 | |||
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SMYRNA, GA-- Registration is now open for the PCB West technical conference and trade show. The premier conference and exhibition for the PCB supply chain, including engineers, designers, fabricators, assemblers and managers, PCB West 2009 will be held September 14 - 18 at the Santa Clara (CA) Marriott. Held annually in the Silicon Valley since 1992, PCB West provides show attendees – printed circuit board (PCB) engineers, designers, fabricators, assemblers and managers – with the most targeted conference in the PCB design industry. PCB West 2009 highlights include:
New this year is a technical conference track on electronics assembly sponsored by the Surface Mount Technology Association (SMTA) and a PCB fabrication track from the editors of Printed Circuit Design & Fab. Attendees who register for the conference by August 24, will receive up to a $100 discount on 3-, 4- and 5-day conference packages. Admission is free for the two-day exhibition, Opening Night Reception, FREE Tuesday and FREE Wednesday technical sessions, and other networking events; however, registration and a badge are required. To register or learn more about the show, visit www.pcbwest.com.
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| Last Updated on Tuesday, 16 June 2009 13:51 |
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Products
Automatic Lamination Techologies Debuts VA 7124 HP6 Vacuum Applicator
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
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Printing Screens Revisited
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
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