| Valor IPO Could Bring $80M |
 |
 |
| Written by Administrator | |||
| Monday, 14 January 2008 22:43 | |||
|
YAVNE, ISRAEL – Software provider Valor Computerized Systems plans an initial public offering of ordinary shares, according to a Securities and Exchange Commission filing. The company did not disclose the expected size or price range of the IPO, but indicated the planned March offering may net up to $80.5 million. The company plans to offer $50 million of shares, while shareholders will make an offer to sell of up to an additional $20 million of their shares and underwriters will be granted options for an additional $10.5 million worth of shares. For the nine months ended Sept. 30, Valor's earnings were $2.2 million on revenue of $31.4 million. Valor, currently traded on the Frankfurt Exchange, said its new symbol will be "VLOR."
|
Design News
- Cadence Returns to Profitability in Q2
- NI Reports Stellar Q2; Record Year Forecast
- Mentor, NI Provide Test Feedback for Designers
- EDA Ranking Shakeup First in Years: UPDATED
- IPC Updates Surface Mount Land Pattern Standard
- Mentor Announces PCB Technology Leadership Awards
- Report: Q1 EDA Revenue Up 4.6% to $1.25B
- Registration Open for PCB West 2010
- New Parts Library Site Follows 'Wiki' Model
- Icahn Boosts Mentor Stake to 11%
Market News
- June NA Printed Circuit Orders Up 28%
- Semi Gear Orders Up Again in June
- Global Q2 PC Shipments Up 21%, Gartner Says
- Components Orders Hit 2-Year High
- US Electronic Warfare Systems Market to top $1.4B by 2015
- SIA: May Global Chip Sales Up 48% YoY
- June Manufacturing Grows at Slower Rate
- May PWB Orders Up 47% YoY
- Report: Q1 Notebook PCs Reach $31B
- Gartner Forecasts 113% Rise in Semi Gear Spending
Fab News
- Eurotech Constructs UK facilities
- DuPont's Electronics Unit Up 53% in Q2
- Sanmina-SCI Swings to Q3 Profit
- PWB Maker Schweizer Rebounds Big
- Meiko to Expand in China, Vietnam
- Camstar Buys SigmaQuest
- Multek Sales on Record Pace
- APCB to Buy CKL
- AT&S Turns in Big Fiscal Q1
- M-Flex Says Prelim. Q3 Sales Up Nearly 4%
Products
ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Sponsor Links
Low Cost PCB Prototypes
PCB-POOL® manufactures high quality PCB prototypes at exceptional prices!
Receive instant quotes (no registration required) and order your PCBs directly online.
Special Offer: Free Laser SMD stencil with all prototype orders!
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
Search
Search
Login
CB Login
Language
Language
Features
In Case You Missed It
Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
Current Issue
Parts
Printed Circuit Design & Fab Magazine on Facebook