December 2005 issue Print E-mail
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Written by Staff   
Monday, 05 December 2005 17:49
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FEATURES

SIMULATION
Modeling and Simulation at System Level
Technology goes forward, but modeling and simulation - from design through manufacture - face many bottlenecks.
by Robert C. Pfahl

INTERCONNECT
Via Modeling
Accurate modeling can keep vias from becoming problems, especially at high speeds. But watch that return current.
by Dave Kohlmeier

COVER STORY
Laser Marking Matrix Codes on PCBs
The one-dimensional barcodes used on groceries don't work as well on circuit boards. The data matrix codes work in low light and can hold a myriad of information.
by Rick Stevenson

PROFIT MARGIN
In Search of Profitable Western PCB Production, Part 1
Yes, there is money to be made building boards - and supplying materials to board shops - outside Asia.
by Mats J. Ehlin

POINT OF VIEW

Our Line
The year in review.
Andy Shaughnessy

ROI
You might learn something from a competitor. But only if you're willing to reciprocate.
Peter Bigelow

Countdown to Lead-free
Although full understanding of whisker growth is lacking, these specifications and practices will reduce risks.
Joe Smetana and Ron Gedney

Interconnect Strategies
Single-ended and differential TDR signatures encompass broad signal integrity applications.
Abe Riazi

No Myths Allowed
A little known trick for reducing crosstalk.
Dr. Eric Bogatin

The Flex Market
Asia's display market makes a comeback.
Dominique Numakura

DEPARTMENTS

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Last Updated on Thursday, 26 January 2006 16:44
 

Products

Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...

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Features

EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....

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