| February 2005 Issue |
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| Written by Administrator | |||
| Tuesday, 01 February 2005 00:00 | |||
FEATURESMIXED SIGNAL CAD LIBRARIES SIGNAL INTEGRITY MARKETS LEAD-FREE PCB WEST 2005
PREVIEW POINT OF VIEWOur Line
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| Last Updated on Tuesday, 25 October 2005 14:49 |
Design News
- Cadence Returns to Profitability in Q2
- NI Reports Stellar Q2; Record Year Forecast
- Mentor, NI Provide Test Feedback for Designers
- EDA Ranking Shakeup First in Years: UPDATED
- IPC Updates Surface Mount Land Pattern Standard
- Mentor Announces PCB Technology Leadership Awards
- Report: Q1 EDA Revenue Up 4.6% to $1.25B
- Registration Open for PCB West 2010
- New Parts Library Site Follows 'Wiki' Model
- Icahn Boosts Mentor Stake to 11%
Market News
- June NA Printed Circuit Orders Up 28%
- Semi Gear Orders Up Again in June
- Global Q2 PC Shipments Up 21%, Gartner Says
- Components Orders Hit 2-Year High
- US Electronic Warfare Systems Market to top $1.4B by 2015
- SIA: May Global Chip Sales Up 48% YoY
- June Manufacturing Grows at Slower Rate
- May PWB Orders Up 47% YoY
- Report: Q1 Notebook PCs Reach $31B
- Gartner Forecasts 113% Rise in Semi Gear Spending
Fab News
- Eurotech Constructs UK facilities
- DuPont's Electronics Unit Up 53% in Q2
- Sanmina-SCI Swings to Q3 Profit
- PWB Maker Schweizer Rebounds Big
- Meiko to Expand in China, Vietnam
- Camstar Buys SigmaQuest
- Multek Sales on Record Pace
- APCB to Buy CKL
- AT&S Turns in Big Fiscal Q1
- M-Flex Says Prelim. Q3 Sales Up Nearly 4%
Products
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Features
Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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