May 2013 Print E-mail
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Monday, 01 April 2013 00:00

May 2013 cover

 

FEATURES

    PCB Layout
    Will a Via Fit in Between?
    BGAs have never been easy to route, but with 0.3mm versions coming, via-in-pad becomes a consideration.
    by Duane Benson

    Thermal Management
    Cool Runnings
    The ongoing push to integrate mechanical and electrical design has now extended to electronics cooling simulation.
    by Mike Buetow


FIRST PERSON

MONEY MATTERS

  • ROI
    Rigid-flex.
    Peter Bigelow

 

TECH TALK


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Last Updated on Monday, 06 May 2013 07:08
 

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