Labtech Microwave Appoints New Principle Engineer Print E-mail
User Rating: / 0
PoorBest 
Written by Kathy Nargi-Toth   
Monday, 08 September 2008 11:55
MILTON KEYNES, UK -- Labtech Microwave has appointed Stephen Melvin as a principal engineer for MMIC (monolithic microwave integrated circuits) packaging and LCP (liquid crystal polymer) products.
 
Prior to joining Labtech Microwave Mr. Melvin was the senior design engineer for RFMD (formerly Filtronic Compound Semiconductors), where he designed MMICs for power amplifiers as well as microwave radio components and broadband MIC (microwave integrated circuit) amplifiers for EW (electronic warfare) applications.

blog comments powered by Disqus
Last Updated on Monday, 08 September 2008 15:56
 

Products

Mentor Graphics Introduces FloTherm IC
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

Printing Screens Revisited
  Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...

Current Issue

March 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook