| EMA Introduces Single User Access to Digi-Key |
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| Written by Kathy Nargi-Toth | |||
| Tuesday, 12 August 2008 09:12 | |||
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ROCHESTER, NY – EMA Design Automation introduces a single user version of the EMA Component Information Portal (CIP) that gives engineers access to the Digi-Key part database through Cadence OrCAD Capture CIS. “With our initial introduction of CIP, we received considerable interest from larger companies looking to improve their part selection processes, however, we also found significant interest from individual users and smaller organizations with similar, but more basic needs,” said Manny Marcano, president and CEO of EMA Design Automation. According to the company, the Digi-Key interface allows users to populate their CIS database directly from Digi-Key along with all related part information. The tool incorporates a comprehensive database with 200 parts including parametric data, datasheets, CIS symbols, and footprints. The CIP system starts at $995 plus the annual maintenance for the single user version.
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Mentor Graphics Introduces FloTherm IC
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data...
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