Valor Appoints New European President Print E-mail
User Rating: / 0
PoorBest 
Written by Tracy Heffner   
Thursday, 25 January 2007 12:01
YAVNE, Israel Valor Computerized Systems Ltd. has appointed Stephan Häfele as the new president of its European operations, Valor Computerized Systems NV. He replaces David Bengal, who has moved into a corporate role as Valor’s vice president of Marketing.
 
Häfele joins Valor from Sigma-C Software AG, where he was responsible for strategic accounts and European sales. He previously held various sales and account management positions at GSI Lumonics Inc. and Orbotech. Häfele started his career as an independent sales representative for Valor, EIE Systems and ETEC in Central Europe.  
 
“We are very pleased to welcome Stephan to the Valor management team. His proven track record and experience in the PCB electronics industry will be a tremendous asset, and strengthen our European organization,” said Valor CEO Ofer Shofman. “We start 2007 with a strong order book, an expanded team, and new next-generation assembly solutions being launched this year. We are well positioned to penetrate new markets and realize the company’s aggressive growth strategy.”
blog comments powered by Disqus
 

Products

Grieve Introduces No. 952 Oven
No. 952 is a 550°F electrically-heated forced air convection bench oven, currently used for various programmed heat processings. Workspace dimensions measure 26" x 22" x 16". 3kW installed in Incoloy-sheathed tubular elements provide heat to the workload. A 1/80-HP recirculating blower creates a convection air movement in the chamber. Features 3" insulated walls, an aluminized steel exterior, Type 430 stainless steel interior and an integral oven stand. Has a programmable and recording temperature controller with 10" diameter circular chart, plus a manual reset excess temperature controller...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

Improving Fabrication Yields
How the CAM engineer can make the difference.  Embedded in fabrication planning is calculating panel size, checking layer stackup information, reviewing expected yields, reviewing board construction and verifying impedance control calculations. Typical panel sizes are 9 x 12˝, 12 x 18˝, 18 x 24˝, or 18 x 36˝. A number of factors need to be considered when calculating panel size. For instance, consider a small board of 25 sq. in. A relatively high number of this small board can be panelized...

Current Issue

January 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook