Polyonics Unveils PolyFLEX Polyimide Flexible Substrates
Written by Mike Buetow   
Friday, 27 July 2012 13:14

PolyFLEX XF-100 series polyimide flexible substrates can be printed with resistive, conductive and semi-conductive inks. Are reportedly suitable for applications that demand dimensional stability after repetitive exposure to high temperatures. Resistant to chemicals normally used in printed circuit boards and electronic devices. Durable top coats enable high resolution printing. Offer dimensional and electrical stability  up to 300°C. Applications include printed electronics, flexible heaters, flexible OLEDs, temperature sensors, flex circuits, smart bandages, RFID antennas, portable devices and electrical circuits. Line includes 1 mil (25µm) to 5 mil (127µm) versions with white or clear print surfaces.

Polyonics, http://www.polyonics.com


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