'Shock Absorbing' Laminate Receives US Patent | Print |  E-mail
Written by Chelsey Drysdale   
Thursday, 23 August 2012 17:44

LAKE FOREST, CAIntegral Technology said it has received a patent for a copper-clad laminate designed to eliminate pad cratering in circuit board assemblies.

The invention describes a high Tg C-stage glass-free insulating layer for rigid printed circuit boards. In use, it acts as a shock absorber to prevent fractures.

Integral Technology markets the product under the name Zeta Cap.
 
The inventor is Christopher Hunrath and the patent number is 8,188,373.


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