BANNOCKBURN, IL – IPC released the A revision of IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry.

The updated standard details materials that let designers and manufacturers move to higher frequencies. Along with enabling the reach of higher frequencies, the revised standard focuses on improved dimensional stability, particularly for adhesiveless assemblies.

IPC-4204A addresses the basic aspects of flexible circuit board design and includes more focused information. Specification sheets at the end of the document provide information for classes of materials, including polyimides, liquid crystal polymers and polyesters.

For more information, visit www.ipc.org/4204.

Committee members are now planning to revise IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. IPC-4203A is expected to be released this fall.