| MFLEX, AT&S to Partner on Rigid-Flex PCBs | | Print | |
| Written by Mike Buetow | |||
| Thursday, 19 January 2012 14:03 | |||
|
LEOBEN, AUSTRIA -- Multi-Fineline Electronix and AT&S today announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. Financial terms were not disclosed. Both companies will also continue to pursue market opportunities in their core businesses. "As global technology leaders, AT&S and MFLEX are leveraging the strengths of each company to jointly manufacture best-in-class HDI rigid-flex printed circuits with assembly capabilities to meet the market needs for complex interconnect solutions," said MFLEX CEO Reza Meshgin. Initial production of HDI rigid-flex printed circuits has commenced, he added. Both companies rank in the top 25 in revenues among all board fabricators, according to the annual NTI 100 published by PCD&F.
Follow us on Twitter: @mikebuetow
|
|||
| Last Updated on Thursday, 19 January 2012 14:25 |
Design News
- Pakistan Hopes New Design Centers Will Aid Push into PCB Market
- PCB West Registration Open
- PCB West Technical Conference Announced
- iNEMI Seeks Participation on Implantable Device Project
- IPC-2581 Standard to be Circulated for Final Vote
- Vast Majority of Parts Placed are SMT, IPC Survey Finds
- Ansys Software Pirate Gets 12 Years
- DoD Seeks Public Input on Contract Obligations Concerning Fake Parts
- iNEMI Releases Counterfeit Parts Assessment
- Plexus Opens 2d Scotland Site
Market News
- Semi Fab Equipment Orders Up Sequentially
- Slow Growth Ahead for Electronics Industry, IPC Says
- US Mfg Orders Slide in April
- April Semi Sales Lag, Moderate Growth Ahead
- Semi Fab Expectations High for US
- Semi Fab Equipment Outlook Improving
- Q1 DRAM Revenue Rises 6% Sequentially
- IDC Downgrades PC Outlook
- Server Shipments Slow in Q1
- IDC Forecasts Tablet Shipments to Grow 58.7% in 2013
Fab News
- LG Innotek to Divest PCB Unit
- BOMcheck Reachs 1M RoHS and REACH Materials Declarations
- Lazer-Tech Acquires Sales Firm
- AT&S to Push into IC Substrate Market
- Partner Suggests More Acquisitions Ahead for Advanced Circuits
- Plasma Technology Workshop Set for Ontario
- Bare Board Market Forecast for 8% CAGR Through 2017
- GBM Expects Auto Sales to Drive New Growth
- New Fine-Line Etching Process Said to Eliminate H2O2
- RoHS2 Webcast Offered this Month
Products
ML605GTW4-UV NC laser drill features two high-energy UV laser oscillator heads. Uses 355nm wavelength suitable for drilling polyimide material/flexible substrates. Mitsubishi Electric, www.mitsubishielectric.co.jp
Search
Search
Login
CB Login
Language
Language
Features
The world’s largest electronics show for Electronics Packaging, Circuits and Assembling (the JPCA Show) was held at Tokyo Big Sight from June 5 through June 7. The following shows were held concurrently in the convention center: Large Electronics Show 2013, JIEP 2013 (Microelectronics Show), Jisso Protech 2013 and Monotsukuri Fiesta 2013. The electronics industry in Japan is suffering its worst slump in history. I was hoping to see some...
- Achieving Proper Placement of Passive Devices Used for Enet Signal Termination
- Hall of Inventors
- Using Forensics to Improve PCB Design and Assembly
- CAD Pioneers Lead Latest Hall Inductees
- Electrical Performance in a Thin Package
- Making PCB Design a Team Approach
- IPC-2581 Consortium Update
- ESD Standards: An Annual Progress Report
- Reinventing Japan
- The Manufacturing Spin
