| Technic, Circuit Automation Collaborate on Screen Printer | | Print | |
| Written by Chelsey Drysdale | |||
| Thursday, 18 March 2010 17:22 | |||
|
CRANSTON, RI – Technic has agreed to a deal under which it will market its coverlay material jointly with Circuit Automation’s DP-1500-FL screen printer. Under the agreement, Technic has the rights to supply the equipment with its LCL 1000 F liquid coverlay material. No financial terms of the agreement were disclosed. The Circuit Automation screen printer is designed for liquid photoimageable coverlay coating of flexible circuit panels. Technic also announced a sale to a large PWB fabricator in Guangdong, China, and production will commence shortly.
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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