DuPont Teaming on LCP Thin-Films for High-Speed PCBs | Print |  E-mail
Written by Mike Buetow   
Monday, 05 August 2013 15:02

RESEARCH TRIANGLE PARK, NC – DuPont Circuit Packaging Materials and IQLP today announced ongoing efforts to further develop and refine liquid crystal polymer thin-films for use in high-speed circuit applications. DuPont plans to use LCP thin-film in the production of circuits for applications such as smart phones, telecom, internet infrastructure, high-speed computing and radar sensing devices.

DuPont said the technology has applications in double-sided copper clad laminates, along with LCP bond ply materials for use in fabricating multilayer circuit boards. If successful, this could boost DuPont's range of products in the high-frequency laminate marketplace, and would complement its existing Pyralux flexible circuit materials and  Interra embedded passive materials for rigid circuit boards product lines, the company said.

Development efforts are being conducted under a joint development agreement and a license agreement.

“DuPont has been developing and expanding its product line for high-speed, high-frequency applications,” said Michael Hennessy, global technology director, DuPont Circuit & Packaging Materials.  “We anticipate that our collaboration with IQLP will lead to opportunities to broaden our existing range of advanced materials for high-speed, high-frequency applications and accelerate time to market for such products.”

DuPont and IQLP anticipate that their ongoing LCP thin-film technology research and development program will ultimately lead to the development and commercialization of dielectric materials that can offer electrical properties up to and over 100GHz. IQLP’s material science – an advancement over current technology – provides tailorable properties, such as dielectric constant and dissipation factor, a tight control over dielectric thickness, and is capable of being manufactured in a high-volume, roll-to-roll format.

“We have been collaborating with DuPont in the area of advanced materials for a number of years,” said Mike Zimmerman, founder and chief executive, IQLP. “The two companies each have a vision of seeing great products being developed and commercialized through advanced materials science.  IQLP has been working on the development of LCP thin-film technology since 2007. Working with DuPont to further develop, refine and ultimately commercialize this technology for the high-frequency film market is a win-win for both companies and the electronics industry.”







CB Login



English French German Italian Portuguese Russian Spanish

Printed Circuit Design & Fab Magazine on Facebook