AT&S, EPCOS Team on Embedding Components | Print |  E-mail
Written by Mike Buetow   
Wednesday, 10 July 2013 13:42

LEONEN, AUSTRIA -- AT&S is collaborating with EPCOS on developing technologies for embedding active and passive electronic components. The parts will be integrated into printed circuit boards for use in smartphones and tablet PCs, the companies said.

AT&S said the partnership will driving standardization of these technologies, which play a "decisive role" in the fabrication of miniature modules.

AT&S and EPCOS will enable smartphone and tablet PC manufacturers significantly improved access to space-saving integration technologies. These offer several advantages: embedding semiconductors and other electronic components in printed circuit boards or other module substrates supports the integration of numerous mobile device functions in an extremely small space, improves overall performance and extends battery life, the firms said.

AT&S has been pushing embedded technology for more than two years, having applied for a patent in 2011.

 

 

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