Thercobond thermally-conductive bonding and printed materials, for power electronics and photonics applications, offer thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability. Contain a new thermal interface composite for improved heat dissipation performance. Can be applied on various substrates by conventional screen printing, drawdown, and inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) or other electronic packaging applications.

Includes DTC-P thermally conductive, electrically insulating materials based on dielectric polymers modified to maximize thermal conductivity with adhesion and wettability to metals and semiconductors. DTC-P is one-part bonding material and has a working temperature up to 300C.

DTC-C thermally conductive, electrically insulating materials are based on dielectric ceramics modified to maximize thermal conductivity with adhesion and wettability to semiconductors, and graphitic substrates. DTC-C is one-part bonding material with a low CTE (< 7 ppm/K after curing), and working temperature up to 400C.

Applied Nanotech Holdings, www.appliednanotech.net