Atmel Publishes Guidelines for SMT Part Placement Print E-mail
Written by Mike Buetow   
Tuesday, 02 April 2013 16:40

SAN JOSE -- Atmel has released a 17-page document detailing application guidelines for successful mounting of the company's surface mount packages.

The application notes cover land patterns by package family, thermal vias, stencil design, solder reflow, component standoff heights and a variety of other guidelines for QFN, TSSOP, BGA, WLSCP, QFP and DFN packages.

Click here to download the pdf: http://www.atmel.com/images/atmel-8826-seeprom-pcb-mounting-guidelines-surface-mount-packages-applicationnote.pdf.

Last Updated on Thursday, 04 April 2013 13:40
 

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