FlexVIA completely self-contained vacuum plasma system treats innerlayers of flexible printed circuits boards prior to lamination, for improved adhesion and reliability. Features a dual-rack chamber that accommodates up to eighteen 20 x 24 inch panels in a single cycle. Both sides of the flex material surface area are treated in a single-step process enabling a rate of 80 to 120 units per hour. Features a space-saving, compact chassis 1651mm wide x 1283mm deep (65" x 94.5") and a horizontal electrode design to provide material alignment for uniform plasma treatment. Does not require use of temperature control, a blower or fluorine gases. Uses environmentally friendly gas plasma solutions such as argon and oxygen. Loads via two, optimum height, easy-access, front-loading doors with a maximum loading height of 1310mm (51.55").

Nordson March, nordsonmarch.com