Polyonics Unveils PolyFLEX Polyimide Flexible Substrates Print E-mail
Written by Mike Buetow   
Friday, 27 July 2012 13:14

PolyFLEX XF-100 series polyimide flexible substrates can be printed with resistive, conductive and semi-conductive inks. Are reportedly suitable for applications that demand dimensional stability after repetitive exposure to high temperatures. Resistant to chemicals normally used in printed circuit boards and electronic devices. Durable top coats enable high resolution printing. Offer dimensional and electrical stability  up to 300°C. Applications include printed electronics, flexible heaters, flexible OLEDs, temperature sensors, flex circuits, smart bandages, RFID antennas, portable devices and electrical circuits. Line includes 1 mil (25µm) to 5 mil (127µm) versions with white or clear print surfaces.

Polyonics, http://www.polyonics.com


blog comments powered by Disqus
Last Updated on Friday, 27 July 2012 13:19
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

New Trends From JPCA Show 2013
The world’s largest electronics show for Electronics Packaging, Circuits and Assembling (the JPCA Show) was held at Tokyo Big Sight from June 5 through June 7.  The following shows were held concurrently in the convention center: Large Electronics Show 2013, JIEP 2013 (Microelectronics Show), Jisso Protech 2013 and Monotsukuri Fiesta 2013. The electronics industry in Japan is suffering its worst slump in history.  I was hoping to see some...
Printed Circuit Design & Fab Magazine on Facebook